AD8109AST
vs
AD8117ABPZ
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
QFP
|
BGA
|
Package Description |
12 X 12 MM, PLASTIC, MO-026BDD, LQFP-80
|
BGA,
|
Pin Count |
80
|
304
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
CROSS POINT SWITCH
|
CROSS POINT SWITCH
|
JESD-30 Code |
S-PQFP-G80
|
S-PBGA-B304
|
JESD-609 Code |
e0
|
e1
|
Length |
12 mm
|
31 mm
|
Moisture Sensitivity Level |
3
|
3
|
Neg Supply Voltage-Max (Vsup) |
-5.5 V
|
|
Neg Supply Voltage-Min (Vsup) |
-4.5 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-2.5 V
|
Number of Channels |
8
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
80
|
304
|
Off-state Isolation-Nom |
98 dB
|
90 dB
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
BGA
|
Package Equivalence Code |
QFP80,.55SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.6 mm
|
1.765 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Switch-on Time-Max |
180 ns
|
|
Technology |
BIPOLAR
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
12 mm
|
31 mm
|
Base Number Matches |
2
|
2
|
Additional Feature |
|
CAN ALSO OPERATE WITH 5V SINGLE SUPPLY
|
|
|
|
Compare AD8109AST with alternatives
Compare AD8117ABPZ with alternatives