AD7870KP
vs
AD7870JP
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
LCC
|
LCC
|
Package Description |
QCCJ,
|
QCCJ,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
Analog Input Voltage-Max |
3 V
|
3 V
|
Analog Input Voltage-Min |
-3 V
|
-3 V
|
Conversion Time-Max |
9 µs
|
9 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
11.5062 mm
|
11.5062 mm
|
Linearity Error-Max (EL) |
0.0244%
|
|
Moisture Sensitivity Level |
1
|
1
|
Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
Output Format |
SERIAL, PARALLEL, 8 BITS, PARALLEL, WORD
|
SERIAL, PARALLEL, 8 BITS, PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
240
|
225
|
Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
11.5062 mm
|
11.5062 mm
|
Base Number Matches |
2
|
2
|
|
|
|
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