AD7854LAQ
vs
AD7854ARSZ
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
DIP
|
SSOP
|
| Package Description |
DIP,
|
SSOP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Input Voltage-Max |
1.25 V
|
1.25 V
|
| Analog Input Voltage-Min |
-1.25 V
|
-1.25 V
|
| Conversion Time-Max |
10 µs
|
4.6 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-GDIP-T28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
e3
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
3
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
260
|
| Sample Rate |
0.1 MHz
|
0.2 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
5.72 mm
|
2 mm
|
| Supply Voltage-Nom |
3.6 V
|
3.6 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
40
|
| Width |
15.24 mm
|
5.3 mm
|
| Base Number Matches |
2
|
2
|
| Length |
|
10.2 mm
|
|
|
|