AD7841BSZ-REEL
vs
MAX5841MEUB
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFP
|
SOIC
|
Package Description |
ROHS COMPLIANT, MO-112AA-1, MQFP-44
|
TSSOP, TSSOP10,.19,20
|
Pin Count |
44
|
10
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
10 V
|
5 V
|
Analog Output Voltage-Min |
-10 V
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
PARALLEL, WORD
|
SERIAL
|
JESD-30 Code |
S-PQFP-G44
|
S-PDSO-G10
|
JESD-609 Code |
e3
|
e4
|
Length |
10 mm
|
3 mm
|
Linearity Error-Max (EL) |
0.0122%
|
0.3906%
|
Moisture Sensitivity Level |
3
|
1
|
Negative Supply Voltage-Nom |
-15 V
|
|
Number of Bits |
14
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
TSSOP
|
Package Equivalence Code |
QFP44,.57SQ,32
|
TSSOP10,.19,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.45 mm
|
1.1 mm
|
Settling Time-Nom (tstl) |
31 µs
|
4 µs
|
Supply Current-Max |
14 mA
|
0.42 mA
|
Supply Voltage-Nom |
15 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
10 mm
|
3 mm
|
Base Number Matches |
1
|
4
|
ECCN Code |
|
EAR99
|
Settling Time-Max |
|
12 µs
|
|
|
|
Compare AD7841BSZ-REEL with alternatives
Compare MAX5841MEUB with alternatives