AD7824TQ/883B
vs
MX7824UQ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
HERMETIC SEALED, CERDIP-24
|
DIP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
5 V
|
5.25 V
|
| Analog Input Voltage-Min |
|
|
| Conversion Time-Max |
2.8 µs
|
2.8 µs
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
R-GDIP-T24
|
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.3906%
|
|
| Number of Analog In Channels |
4
|
4
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Bit Code |
BINARY, COMPLEMENTARY OFFSET BINARY
|
COMPLEMENTARY OFFSET BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24(UNSPEC)
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
0.1 MHz
|
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare AD7824TQ/883B with alternatives
Compare MX7824UQ with alternatives