AD7821TCHIPS
vs
5962-8951801RA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ANALOG DEVICES INC
ROCHESTER ELECTRONICS INC
Part Package Code
DIE
DIP
Package Description
DIE,
DIP,
Pin Count
20
20
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
Analog Input Voltage-Max
2.5 V
2.5 V
Analog Input Voltage-Min
-2.5 V
-2.5 V
Conversion Time-Max
0.66 µs
0.975 µs
Converter Type
ADC, FLASH METHOD
ADC, FLASH METHOD
JESD-30 Code
X-XUUC-N20
R-GDIP-T20
Linearity Error-Max (EL)
0.3906%
0.3906%
Negative Supply Voltage-Nom
-5 V
Number of Analog In Channels
1
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Bit Code
BINARY, OFFSET BINARY
BINARY
Output Format
PARALLEL, 8 BITS
PARALLEL, 8 BITS
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT APPLICABLE
Qualification Status
Not Qualified
MILITARY
Sample Rate
1 MHz
1 MHz
Sample and Hold / Track and Hold
TRACK
TRACK
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
BICMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT APPLICABLE
Base Number Matches
1
3
JESD-609 Code
e0
Moisture Sensitivity Level
NOT APPLICABLE
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
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