AD774BBD
vs
SP774BSQ
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
SIPEX CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP28,.6
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
8 µs
|
8 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
| Length |
35.815 mm
|
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0244%
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Negative Supply Voltage-Nom |
-12 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
3.68 mm
|
|
| Supply Voltage-Nom |
12 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
NOT SPECIFIED
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP28,.6
|
| Sample Rate |
|
0.125 MHz
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
|
|
|
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