AD7572SQ05/883B
vs
AD7572TQ05
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP, DIP24,.3
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog Input Voltage-Max |
5 V
|
5 V
|
| Analog Input Voltage-Min |
|
|
| Conversion Time-Max |
5.2 µs
|
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
A/D CONVERTER
|
| JESD-30 Code |
R-GDIP-T24
|
R-XDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.0244%
|
0.024%
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Negative Supply Voltage-Nom |
-15 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Bit Code |
BINARY
|
OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
MILITARY
|
|
| Sample and Hold / Track and Hold |
SAMPLE
|
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
5.715 mm
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP24,.3
|
|
|
|