AD7542JPZ-REEL
vs
AD7542KP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
PLASTIC, LCC-20
|
LCC-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
Input Format |
PARALLEL, 4 BITS
|
PARALLEL, 4 BITS
|
JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
JESD-609 Code |
e3
|
e0
|
Length |
8.9662 mm
|
8.9662 mm
|
Linearity Error-Max (EL) |
0.0244%
|
0.0122%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC20,.4SQ
|
LDCC20,.4SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Settling Time-Max |
2 µs
|
2 µs
|
Settling Time-Nom (tstl) |
0.25 µs
|
0.25 µs
|
Supply Current-Max |
2.5 mA
|
2.5 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
8.9662 mm
|
8.9662 mm
|
Base Number Matches |
2
|
4
|
|
|
|
Compare AD7542JPZ-REEL with alternatives
Compare AD7542KP with alternatives