AD7533UD/883B
vs
MX7533LN+
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
JESD-30 Code |
R-XDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e3
|
Linearity Error-Max (EL) |
0.05%
|
0.0488%
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Voltage-Nom |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Input Format |
|
PARALLEL, WORD
|
Length |
|
19.175 mm
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
4.572 mm
|
Settling Time-Max |
|
0.8 µs
|
Supply Current-Max |
|
2 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
7.62 mm
|
|
|
|
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