AD7524JP-REEL
vs
DAC0802LJ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
DIP, DIP16,.3
|
| Pin Count |
20
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.9662 mm
|
19.43 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.1%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
DIP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Settling Time-Max |
|
|
| Settling Time-Nom (tstl) |
0.5 µs
|
0.1 µs
|
| Supply Current-Max |
2 mA
|
7.8 mA
|
| Supply Voltage-Nom |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.9662 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Negative Supply Voltage-Nom |
|
-15 V
|
|
|
|
Compare AD7524JP-REEL with alternatives
Compare DAC0802LJ with alternatives