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AD73311ARS-REEL vs SA636DK/01,118 feature comparison

AD73311ARS-REEL Rochester Electronics LLC

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SA636DK/01,118 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SSOP SSOP2
Package Description SSOP, SSOP-20
Pin Count 20 20
Reach Compliance Code unknown compliant
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e4
Length 7.2 mm 6.5 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2 mm 1.5 mm
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 4.4 mm
Base Number Matches 2 1
Manufacturer Package Code SOT266-1
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Package Equivalence Code SSOP20,.25
Telecommunication Circuits » Other Telecom ICs
Telecommunication Circuits » Other Telecom ICs

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