ACE1502EMT8
vs
PIC12F508T-E/MC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DFN
Package Description
TSSOP,
3 X 2 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, DFN-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
25 MHz
4 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G8
R-PDSO-N8
JESD-609 Code
e3
e3
Length
4.4 mm
3 mm
Moisture Sensitivity Level
1
1
Number of I/O Lines
6
6
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
ROM Programmability
EEPROM
FLASH
Seated Height-Max
1.1 mm
1 mm
Speed
25 MHz
4 MHz
Supply Voltage-Max
3.6 V
5.5 V
Supply Voltage-Min
1.8 V
2 V
Supply Voltage-Nom
2.2 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
3 mm
2 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER, RISC
Base Number Matches
2
1
On Chip Program ROM Width
8
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
25
ROM (words)
768
Time@Peak Reflow Temperature-Max (s)
40
Compare ACE1502EMT8 with alternatives
Compare PIC12F508T-E/MC with alternatives