A80C186XL20
vs
PACE1757M-30PGMB
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
PYRAMID SEMICONDUCTOR CORP
|
Part Package Code |
PGA
|
PGA
|
Package Description |
PGA, PGA68,11X11
|
|
Pin Count |
68
|
68
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
|
|
Address Bus Width |
20
|
16
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
40 MHz
|
30 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-CPGA-P68
|
S-CPGA-P68
|
Length |
29.464 mm
|
28.5623 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
2
|
|
Number of External Interrupts |
5
|
8
|
Number of Serial I/Os |
|
|
Number of Terminals |
68
|
68
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Equivalence Code |
PGA68,11X11
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
5.21 mm
|
4.572 mm
|
Speed |
20 MHz
|
30 MHz
|
Supply Current-Max |
90 mA
|
310 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
29.464 mm
|
28.5623 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
4
|
1
|
|
|
|
Compare A80C186XL20 with alternatives
Compare PACE1757M-30PGMB with alternatives