A54SX72AFG484M vs A54SX72AFG484 feature comparison

A54SX72AFG484M Microchip Technology Inc

Buy Now Datasheet

A54SX72AFG484 Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM PITCH, FBGA-484 1 MM PITCH, FBGA-484
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 72000 TYPICAL GATES AVAILABLE 72000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 217 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.5 ns 1.5 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6036 6036
Number of Equivalent Gates 108000 108000
Number of Inputs 360 360
Number of Logic Cells 6036 6036
Number of Outputs 360 360
Number of Terminals 484 484
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 6036 CLBS, 108000 GATES 6036 CLBS, 108000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,26X26,40 BGA484,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 5
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 20

Compare A54SX72AFG484M with alternatives

Compare A54SX72AFG484 with alternatives