A54SX72A-CQ256I
vs
A54SX72A-CQG256C
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
CERAMIC, QFP-256
|
QFF,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
72000 TYPICAL GATES AVAILABLE
|
2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION, 5.0V INPUT TOLERANCE
|
| Combinatorial Delay of a CLB-Max |
1.3 ns
|
1.5 ns
|
| JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
| Length |
36 mm
|
|
| Number of CLBs |
6036
|
6036
|
| Number of Equivalent Gates |
108000
|
72000
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
6036 CLBS, 108000 GATES
|
6036 CLBS, 72000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QFF
|
| Package Equivalence Code |
TPAK256,3SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.69 mm
|
|
| Supply Voltage-Max |
2.75 V
|
2.7 V
|
| Supply Voltage-Min |
2.25 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
36 mm
|
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
Yes
|
| Clock Frequency-Max |
|
206 MHz
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
GOLD OVER NICKEL
|
|
|
|
Compare A54SX72A-CQ256I with alternatives
Compare A54SX72A-CQG256C with alternatives