A54SX72A-CQ256C
vs
A54SX72A-FCQ256M
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFF,
|
CERAMIC, QFP-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION, 5.0V INPUT TOLERANCE
|
72000 TYPICAL GATES AVAILABLE
|
Clock Frequency-Max |
206 MHz
|
172 MHz
|
Combinatorial Delay of a CLB-Max |
1.5 ns
|
1.8 ns
|
JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
JESD-609 Code |
e0
|
e0
|
Number of CLBs |
6036
|
6036
|
Number of Equivalent Gates |
72000
|
108000
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
6036 CLBS, 72000 GATES
|
6036 CLBS, 108000 GATES
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFF
|
QFF
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
2.7 V
|
|
Supply Voltage-Min |
2.3 V
|
|
Supply Voltage-Nom |
2.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Length |
|
36 mm
|
Number of Inputs |
|
213
|
Number of Logic Cells |
|
6036
|
Number of Outputs |
|
213
|
Package Equivalence Code |
|
TPAK256,3SQ,20
|
Seated Height-Max |
|
2.69 mm
|
Terminal Pitch |
|
0.5 mm
|
Width |
|
36 mm
|
|
|
|
Compare A54SX72A-CQ256C with alternatives
Compare A54SX72A-FCQ256M with alternatives