A54SX32BG313 vs A54SX32-BGG313 feature comparison

A54SX32BG313 Microsemi FPGA & SoC

Buy Now Datasheet

A54SX32-BGG313 Microsemi Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code BGA
Package Description BGA, BGA, BGA313,25X25,50
Pin Count 313
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max 240 MHz 240 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B313 S-PBGA-B313
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 2880
Number of Equivalent Gates 32000 32000
Number of Terminals 313 313
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2880 CLBS, 32000 GATES 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA313,25X25,50 BGA313,25X25,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 2.52 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 4
Number of Inputs 249
Number of Logic Cells 2880
Number of Outputs 249

Compare A54SX32BG313 with alternatives

Compare A54SX32-BGG313 with alternatives