A54SX32BG313
vs
A54SX32-BG313M
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA,
PLASTIC, BGA-313
Pin Count
313
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max
240 MHz
240 MHz
Combinatorial Delay of a CLB-Max
0.9 ns
0.9 ns
JESD-30 Code
S-PBGA-B313
S-PBGA-B313
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2880
2880
Number of Equivalent Gates
32000
32000
Number of Terminals
313
313
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
2880 CLBS, 32000 GATES
2880 CLBS, 32000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA313,25X25,50
BGA313,25X25,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.52 mm
2.52 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
2
2
ECCN Code
3A001.A.2.C
Number of Inputs
249
Number of Logic Cells
2880
Number of Outputs
249
Compare A54SX32BG313 with alternatives
Compare A54SX32-BG313M with alternatives