A54SX32BG313
vs
A54SX16A-TQG144M
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA,
Pin Count
313
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Additional Feature
CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
240 MHz
227 MHz
Combinatorial Delay of a CLB-Max
0.9 ns
1.4 ns
JESD-30 Code
S-PBGA-B313
S-PQFP-G144
JESD-609 Code
e0
e3
Length
35 mm
20 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2880
1452
Number of Equivalent Gates
32000
24000
Number of Terminals
313
144
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
2880 CLBS, 32000 GATES
1452 CLBS, 24000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFQFP
Package Equivalence Code
BGA313,25X25,50
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.52 mm
1.6 mm
Supply Voltage-Max
3.6 V
2.75 V
Supply Voltage-Min
3 V
2.25 V
Supply Voltage-Nom
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
35 mm
20 mm
Base Number Matches
2
2
Number of Inputs
113
Number of Logic Cells
1452
Number of Outputs
113
Compare A54SX32BG313 with alternatives
Compare A54SX16A-TQG144M with alternatives