A54SX32AFG256A
vs
A54SX32A-FG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
BGA, BGA256,16X16,40
LBGA,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Additional Feature
32000 TYPICAL GATES AVAILABLE
32000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
238 MHz
Combinatorial Delay of a CLB-Max
1.2 ns
1.2 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2880
2880
Number of Equivalent Gates
48000
48000
Number of Inputs
203
Number of Logic Cells
2880
Number of Outputs
203
Number of Terminals
256
256
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2880 CLBS, 48000 GATES
2880 CLBS, 48000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.68 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
3
2
Pbfree Code
Part Package Code
BGA
Pin Count
256
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
225
Terminal Finish
TIN LEAD/TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s)
30
Compare A54SX32AFG256A with alternatives
Compare A54SX32A-FG256I with alternatives