A54SX32A-FGG256A vs A54SX32A-FG256A feature comparison

A54SX32A-FGG256A Microchip Technology Inc

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A54SX32A-FG256A Microsemi FPGA & SoC

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code compliant compliant
Factory Lead Time 10 Weeks
Additional Feature 32000 TYPICAL GATES AVAILABLE ALSO REQUIRES AN SUPPLU OF 3.3V
Clock Frequency-Max 238 MHz
Combinatorial Delay of a CLB-Max 1.2 ns 1.5 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 1980
Number of Equivalent Gates 48000 32000
Number of Inputs 203
Number of Logic Cells 2880
Number of Outputs 203
Number of Terminals 256 256
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2880 CLBS, 48000 GATES 1980 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.97 mm 1.7 mm
Supply Voltage-Max 2.75 V 2.625 V
Supply Voltage-Min 2.25 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN SILVER COPPER TIN LEAD/TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 2
Pbfree Code No
Part Package Code BGA
Package Description LBGA,
Pin Count 256

Compare A54SX32A-FGG256A with alternatives

Compare A54SX32A-FG256A with alternatives