A54SX32A-2FGG484 vs A54SX32A-1FG484MX79 feature comparison

A54SX32A-2FGG484 Microsemi Corporation

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A54SX32A-1FG484MX79 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA484,26X26,40 BGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 32000 TYPICAL GATES AVAILABLE 32000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 313 MHz 278 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 1.1 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 2880
Number of Equivalent Gates 48000 48000
Number of Inputs 249
Number of Logic Cells 2880
Number of Outputs 249
Number of Terminals 484 484
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2880 CLBS, 48000 GATES 2880 CLBS, 48000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
Base Number Matches 3 1
ECCN Code 3A001.A.2.C

Compare A54SX32A-2FGG484 with alternatives

Compare A54SX32A-1FG484MX79 with alternatives