A54SX32A-1FGG256 vs A54SX32A-3FGG256A feature comparison

A54SX32A-1FGG256 Microchip Technology Inc

Buy Now Datasheet

A54SX32A-3FGG256A Microsemi Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM PITCH, ROHS COMPLIANT, FBGA-256 LBGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 10 Weeks
Additional Feature 32000 TYPICAL GATES AVAILABLE 32000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 278 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 0.8 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 2880
Number of Equivalent Gates 48000 48000
Number of Inputs 203
Number of Logic Cells 2880
Number of Outputs 203
Number of Terminals 256 256
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 2880 CLBS, 48000 GATES 2880 CLBS, 48000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.97 mm 1.68 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 17 mm
Base Number Matches 4 1

Compare A54SX32A-1FGG256 with alternatives

Compare A54SX32A-3FGG256A with alternatives