A54SX32A-1BG329 vs A54SX32-2BG329I feature comparison

A54SX32A-1BG329 Microsemi Corporation

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A54SX32-2BG329I Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA329,23X23,50 BGA, BGA329,23X23,50
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 32000 TYPICAL GATES AVAILABLE CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max 278 MHz 320 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 0.7 ns
JESD-30 Code S-PBGA-B329 S-PBGA-B329
JESD-609 Code e0 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 2880
Number of Equivalent Gates 48000 32000
Number of Inputs 249 249
Number of Logic Cells 2880 2880
Number of Outputs 249 249
Number of Terminals 329 329
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2880 CLBS, 48000 GATES 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA329,23X23,50 BGA329,23X23,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.7 mm 2.7 mm
Supply Voltage-Max 2.75 V 3.6 V
Supply Voltage-Min 2.25 V 3 V
Supply Voltage-Nom 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 3 3

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Compare A54SX32-2BG329I with alternatives