A54SX32-BG313MX79 vs A54SX32-BG313IX79 feature comparison

A54SX32-BG313MX79 Microsemi Corporation

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A54SX32-BG313IX79 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, PLASTIC, BGA-313
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max 240 MHz 240 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B313 S-PBGA-B313
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 2880
Number of Equivalent Gates 32000 32000
Number of Terminals 313 313
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2880 CLBS, 32000 GATES 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA313,25X25,50 BGA313,25X25,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 2.52 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 3 3
Number of Inputs 249
Number of Outputs 249

Compare A54SX32-BG313MX79 with alternatives

Compare A54SX32-BG313IX79 with alternatives