A54SX32-3BGG313M
vs
A54SX16P-2PQG208I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA, BGA313,25X25,50
|
ROHS COMPLIANT, PLASTIC, QFP-208
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
|
CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE
|
| Clock Frequency-Max |
350 MHz
|
320 MHz
|
| Combinatorial Delay of a CLB-Max |
0.6 ns
|
0.7 ns
|
| JESD-30 Code |
S-PBGA-B313
|
S-PQFP-G208
|
| JESD-609 Code |
e1
|
e3
|
| Length |
35 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
2880
|
1452
|
| Number of Equivalent Gates |
32000
|
16000
|
| Number of Inputs |
249
|
175
|
| Number of Logic Cells |
2880
|
1452
|
| Number of Outputs |
249
|
175
|
| Number of Terminals |
313
|
208
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
2880 CLBS, 32000 GATES
|
1452 CLBS, 16000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
FQFP
|
| Package Equivalence Code |
BGA313,25X25,50
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.52 mm
|
4.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
35 mm
|
28 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
12 Weeks
|
| Packing Method |
|
TRAY
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A54SX32-3BGG313M with alternatives
Compare A54SX16P-2PQG208I with alternatives