A54SX32-2BG313I vs A54SX32-2BG313M feature comparison

A54SX32-2BG313I Microchip Technology Inc

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A54SX32-2BG313M Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description PLASTIC, BGA-313 BGA, BGA313,25X25,50
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max 320 MHz 320 MHz
Combinatorial Delay of a CLB-Max 0.7 ns 0.7 ns
JESD-30 Code S-PBGA-B313 S-PBGA-B313
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 2880
Number of Equivalent Gates 32000 32000
Number of Inputs 249 249
Number of Logic Cells 2880 2880
Number of Outputs 249 249
Number of Terminals 313 313
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 2880 CLBS, 32000 GATES 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA313,25X25,50 BGA313,25X25,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 2.52 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 1
ECCN Code 3A001.A.2.C

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