A54SX32-1CQG208
vs
A54SX32-1CQG208M
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
CERAMIC, QFP-208
|
QFF,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
48000 SYSTEM GATES AVAILABLE
|
48000 SYSTEM GATES AVAILABLE
|
Clock Frequency-Max |
280 MHz
|
240 MHz
|
Combinatorial Delay of a CLB-Max |
0.9 ns
|
0.9 ns
|
JESD-30 Code |
S-CQFP-F208
|
S-CQFP-F208
|
JESD-609 Code |
e4
|
e4
|
Length |
29.21 mm
|
29.21 mm
|
Number of CLBs |
2880
|
2880
|
Number of Equivalent Gates |
32000
|
32000
|
Number of Inputs |
174
|
|
Number of Outputs |
174
|
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
2880 CLBS, 32000 GATES
|
2880 CLBS, 32000 GATES
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFF
|
QFF
|
Package Equivalence Code |
TPAK208,2.9SQ,20
|
TPAK208,2.9SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.06 mm
|
3.06 mm
|
Supply Voltage-Max |
3.6 V
|
3.63 V
|
Supply Voltage-Min |
3 V
|
2.97 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
GOLD OVER NICKEL
|
GOLD OVER NICKEL
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
29.21 mm
|
29.21 mm
|
Base Number Matches |
4
|
1
|
ECCN Code |
|
3A001.A.2.C
|
|
|
|
Compare A54SX32-1CQG208 with alternatives
Compare A54SX32-1CQG208M with alternatives