A54SX32-1BG313MX79 vs A54SX16A-1PQG208 feature comparison

A54SX32-1BG313MX79 Microsemi Corporation

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A54SX16A-1PQG208 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, PLASTIC, ROHS COMPLIANT, QFP-208
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE 16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 280 MHz 263 MHz
Combinatorial Delay of a CLB-Max 0.8 ns 1.2 ns
JESD-30 Code S-PBGA-B313 S-PQFP-G208
JESD-609 Code e1 e3
Length 35 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 1452
Number of Equivalent Gates 32000 24000
Number of Inputs 249 175
Number of Outputs 249 175
Number of Terminals 313 208
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 2880 CLBS, 32000 GATES 1452 CLBS, 24000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Equivalence Code BGA313,25X25,50 QFP208,1.2SQ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 4.1 mm
Supply Voltage-Max 3.6 V 2.75 V
Supply Voltage-Min 3 V 2.25 V
Supply Voltage-Nom 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN SILVER COPPER MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 35 mm 28 mm
Base Number Matches 1 4
Factory Lead Time 14 Weeks
Number of Logic Cells 1452
Packing Method TRAY
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare A54SX16A-1PQG208 with alternatives