A54SX16PPQG208
vs
A54SX16ATQ100MX79
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
FQFP,
|
1.40 MM HEIGHT, TQFP-100
|
| Pin Count |
208
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
CAN ALSO BE OPERATED AT 3.3V
|
16000 TYPICAL GATES AVAILABLE
|
| Clock Frequency-Max |
240 MHz
|
227 MHz
|
| Combinatorial Delay of a CLB-Max |
0.9 ns
|
1.4 ns
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G100
|
| JESD-609 Code |
e3
|
|
| Length |
28 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
1452
|
1452
|
| Number of Equivalent Gates |
16000
|
24000
|
| Number of Terminals |
208
|
100
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
1452 CLBS, 16000 GATES
|
1452 CLBS, 24000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.6 V
|
2.75 V
|
| Supply Voltage-Min |
3 V
|
2.25 V
|
| Supply Voltage-Nom |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
28 mm
|
14 mm
|
| Base Number Matches |
3
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare A54SX16PPQG208 with alternatives
Compare A54SX16ATQ100MX79 with alternatives