A54SX16P-P2VQ100M
vs
A54SX32-1BG313PP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
TFQFP,
PLASTIC, MO-151, BGA-313
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max
320 MHz
280 MHz
Combinatorial Delay of a CLB-Max
0.7 ns
0.8 ns
JESD-30 Code
S-PQFP-G100
S-PBGA-B313
JESD-609 Code
e0
e0
Length
14 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1452
2880
Number of Equivalent Gates
16000
32000
Number of Terminals
100
313
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
1452 CLBS, 16000 GATES
2880 CLBS, 32000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
IBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
GRID ARRAY, INTERSTITIAL PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.52 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
35 mm
Base Number Matches
3
3
Number of Inputs
249
Number of Logic Cells
2880
Number of Outputs
249
Package Equivalence Code
BGA313,25X25,50
Compare A54SX16P-P2VQ100M with alternatives
Compare A54SX32-1BG313PP with alternatives