A54SX16CQG208M
vs
A54SX16-1CQ208E
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFF,
|
CAVITY-UP, CERAMIC, QFP-208
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
24000 SYSTEM GATES AVAILABLE
|
IT CAN ALSO OPERATE FROM 4.5V TO 5.5V
|
| Clock Frequency-Max |
205 MHz
|
240 MHz
|
| Combinatorial Delay of a CLB-Max |
1 ns
|
0.9 ns
|
| JESD-30 Code |
S-CQFP-F208
|
S-CQFP-F208
|
| JESD-609 Code |
e4
|
e0
|
| Length |
29.21 mm
|
29.21 mm
|
| Number of CLBs |
1452
|
1452
|
| Number of Equivalent Gates |
16000
|
16000
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
1452 CLBS, 16000 GATES
|
1452 CLBS, 16000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
HGQFF
|
| Package Equivalence Code |
TPAK208,2.9SQ,20
|
TPAK208,2.9SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, HEAT SINK/SLUG, GUARD RING
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.06 mm
|
3.56 mm
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
GOLD OVER NICKEL
|
TIN LEAD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
29.21 mm
|
29.21 mm
|
| Base Number Matches |
1
|
1
|
| Number of Inputs |
|
172
|
| Number of Logic Cells |
|
1452
|
| Number of Outputs |
|
172
|
|
|
|
Compare A54SX16CQG208M with alternatives
Compare A54SX16-1CQ208E with alternatives