A54SX16APQ208X79
vs
A54SX16APQG208
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FQFP,
PLASTIC, ROHS COMPLIANT, QFP-208
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
16000 TYPICAL GATES AVAILABLE
16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
227 MHz
227 MHz
Combinatorial Delay of a CLB-Max
1.4 ns
1.4 ns
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
Length
28 mm
28 mm
Number of CLBs
1452
1452
Number of Equivalent Gates
24000
24000
Number of Terminals
208
208
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1452 CLBS, 24000 GATES
1452 CLBS, 24000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
28 mm
28 mm
Base Number Matches
3
3
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
3
Number of Inputs
175
Number of Logic Cells
1452
Number of Outputs
175
Package Equivalence Code
QFP208,1.2SQ
Peak Reflow Temperature (Cel)
245
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare A54SX16APQ208X79 with alternatives
Compare A54SX16APQG208 with alternatives