A54SX16APQ208MX79
vs
A54SX32-1BG313PP
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
FQFP,
|
IBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
16000 TYPICAL GATES AVAILABLE
|
|
Clock Frequency-Max |
227 MHz
|
280 MHz
|
Combinatorial Delay of a CLB-Max |
1.4 ns
|
0.8 ns
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B313
|
Length |
28 mm
|
35 mm
|
Number of CLBs |
1452
|
2880
|
Number of Equivalent Gates |
24000
|
32000
|
Number of Terminals |
208
|
313
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
1452 CLBS, 24000 GATES
|
2880 CLBS, 32000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
IBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, INTERSTITIAL PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
2.52 mm
|
Supply Voltage-Max |
2.75 V
|
|
Supply Voltage-Min |
2.25 V
|
|
Supply Voltage-Nom |
2.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA313,25X25,50
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare A54SX16APQ208MX79 with alternatives
Compare A54SX32-1BG313PP with alternatives