A54SX16APQ208I vs A54SX32-BGG313M feature comparison

A54SX16APQ208I Microsemi FPGA & SoC

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A54SX32-BGG313M Microchip Technology Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description FQFP, QFP208,1.2SQ ROHS COMPLIANT, PLASTIC, BGA-313
Pin Count 208
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max 227 MHz 240 MHz
Combinatorial Delay of a CLB-Max 1.4 ns 0.9 ns
JESD-30 Code S-PQFP-G208 S-PBGA-B313
JESD-609 Code e0 e1
Length 28 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 2880
Number of Equivalent Gates 24000 32000
Number of Inputs 175 249
Number of Logic Cells 1452 2880
Number of Outputs 175 249
Number of Terminals 208 313
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 1452 CLBS, 24000 GATES 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Equivalence Code QFP208,1.2SQ BGA313,25X25,50
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.52 mm
Supply Voltage-Max 2.75 V 3.6 V
Supply Voltage-Min 2.25 V 3 V
Supply Voltage-Nom 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 28 mm 35 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C

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