A54SX16A-TQ144A vs A54SX32-1BG313PP feature comparison

A54SX16A-TQ144A Microsemi FPGA & SoC

Buy Now Datasheet

A54SX32-1BG313PP Microsemi Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code QFP
Package Description 1.40 MM PITCH, PLASTIC TQFP-144 IBGA,
Pin Count 144
Reach Compliance Code compliant compliant
Additional Feature ALSO REQUIRES AN SUPPLU OF 3.3V
Combinatorial Delay of a CLB-Max 1.5 ns 0.8 ns
JESD-30 Code S-PQFP-G144 S-PBGA-B313
JESD-609 Code e0 e0
Length 20 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 990 2880
Number of Equivalent Gates 16000 32000
Number of Terminals 144 313
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 990 CLBS, 16000 GATES 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP IBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, INTERSTITIAL PITCH
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.52 mm
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 20 mm 35 mm
Base Number Matches 1 1
HTS Code 8542.39.00.01
Clock Frequency-Max 280 MHz

Compare A54SX16A-TQ144A with alternatives

Compare A54SX32-1BG313PP with alternatives