A54SX16A-TQ144A
vs
A54SX16A-TQ144AX79
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
1.40 MM PITCH, PLASTIC TQFP-144
|
|
| Pin Count |
144
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
ALSO REQUIRES AN SUPPLU OF 3.3V
|
ALSO REQUIRES AN SUPPLU OF 3.3V
|
| Combinatorial Delay of a CLB-Max |
1.5 ns
|
1.5 ns
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
990
|
1452
|
| Number of Equivalent Gates |
16000
|
24000
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
990 CLBS, 16000 GATES
|
990 CLBS, 16000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
20 mm
|
20 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare A54SX16A-TQ144A with alternatives
Compare A54SX16A-TQ144AX79 with alternatives