A54SX16A-FGG256A vs A54SX16A-FG256AX79 feature comparison

A54SX16A-FGG256A Microsemi FPGA & SoC

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A54SX16A-FG256AX79 Microsemi Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code BGA
Package Description LBGA,
Pin Count 256
Reach Compliance Code compliant compliant
Additional Feature ALSO REQUIRES AN SUPPLU OF 3.3V ALSO REQUIRES AN SUPPLU OF 3.3V
Combinatorial Delay of a CLB-Max 1.5 ns 1.5 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 990 1452
Number of Equivalent Gates 16000 24000
Number of Terminals 256 256
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 990 CLBS, 16000 GATES 990 CLBS, 16000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm 17 mm
Base Number Matches 1 1
HTS Code 8542.39.00.01

Compare A54SX16A-FGG256A with alternatives

Compare A54SX16A-FG256AX79 with alternatives