A54SX16A-FG144A
vs
A54SX16A-FGG144A
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI SOC PRODUCTS GROUP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
LBGA,
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
ALSO REQUIRES AN SUPPLU OF 3.3V
|
ALSO REQUIRES AN SUPPLU OF 3.3V
|
| Combinatorial Delay of a CLB-Max |
1.5 ns
|
1.5 ns
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| JESD-609 Code |
e0
|
e1
|
| Length |
13 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
990
|
990
|
| Number of Equivalent Gates |
16000
|
16000
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
990 CLBS, 16000 GATES
|
990 CLBS, 16000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD SILVER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare A54SX16A-FG144A with alternatives
Compare A54SX16A-FGG144A with alternatives