A54SX16A-FFGG256I vs A54SX16A-2FG256IX79 feature comparison

A54SX16A-FFGG256I Microchip Technology Inc

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A54SX16A-2FG256IX79 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM, FBGA-256 BGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE 16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 172 MHz 294 MHz
Combinatorial Delay of a CLB-Max 1.9 ns 1 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 1452
Number of Equivalent Gates 24000 24000
Number of Inputs 180
Number of Logic Cells 1452
Number of Outputs 180
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1452 CLBS, 24000 GATES 1452 CLBS, 24000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.97 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 17 mm
Base Number Matches 3 2

Compare A54SX16A-FFGG256I with alternatives

Compare A54SX16A-2FG256IX79 with alternatives