A54SX16A-FFGG256A vs A54SX16A-FGG256 feature comparison

A54SX16A-FFGG256A Microchip Technology Inc

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A54SX16A-FGG256 Microsemi FPGA & SoC

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description 1 MM, FBGA-256 1 MM, FBGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE 16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 172 MHz
Combinatorial Delay of a CLB-Max 1.9 ns 1.4 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 1452
Number of Equivalent Gates 24000 24000
Number of Inputs 180
Number of Logic Cells 1452
Number of Outputs 180
Number of Terminals 256 256
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1452 CLBS, 24000 GATES 1452 CLBS, 24000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.68 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 17 mm 17 mm
Base Number Matches 1 3
Pbfree Code Yes
Part Package Code BGA
Pin Count 256

Compare A54SX16A-FFGG256A with alternatives

Compare A54SX16A-FGG256 with alternatives