A54SX16A-FFG144A vs A54SX16A-FG144A feature comparison

A54SX16A-FFG144A Microsemi Corporation

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A54SX16A-FG144A Microsemi FPGA & SoC

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description LBGA, BGA144,12X12,40 LBGA,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE ALSO REQUIRES AN SUPPLU OF 3.3V
Combinatorial Delay of a CLB-Max 1.9 ns 1.5 ns
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 990
Number of Equivalent Gates 24000 16000
Number of Inputs 111
Number of Logic Cells 1452
Number of Outputs 111
Number of Terminals 144 144
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1452 CLBS, 24000 GATES 990 CLBS, 16000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 2.75 V 2.625 V
Supply Voltage-Min 2.25 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN LEAD SILVER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 3 2
Pbfree Code No
Part Package Code BGA
Pin Count 144
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

Compare A54SX16A-FFG144A with alternatives

Compare A54SX16A-FG144A with alternatives