A54SX16A-3TQ144I vs A54SX32-3BGG313M feature comparison

A54SX16A-3TQ144I Microsemi Corporation

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A54SX32-3BGG313M Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description , BGA, BGA313,25X25,50
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 2 3
Rohs Code Yes
ECCN Code 3A001.A.2.C
Additional Feature CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
Clock Frequency-Max 350 MHz
Combinatorial Delay of a CLB-Max 0.6 ns
JESD-30 Code S-PBGA-B313
JESD-609 Code e1
Length 35 mm
Moisture Sensitivity Level 3
Number of CLBs 2880
Number of Equivalent Gates 32000
Number of Inputs 249
Number of Logic Cells 2880
Number of Outputs 249
Number of Terminals 313
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 2880 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA313,25X25,50
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.52 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm

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