A54SX16A-3FG256 vs A54SX16A-FGG256A feature comparison

A54SX16A-3FG256 Microsemi Corporation

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A54SX16A-FGG256A Microsemi FPGA & SoC

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description , LBGA,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 256
Additional Feature ALSO REQUIRES AN SUPPLU OF 3.3V
Combinatorial Delay of a CLB-Max 1.5 ns
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 990
Number of Equivalent Gates 16000
Number of Terminals 256
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 990 CLBS, 16000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm

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