A54SX16A-2FGG144A vs A54SX16A-2FG144I feature comparison

A54SX16A-2FGG144A Microchip Technology Inc

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A54SX16A-2FG144I Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM, FBGA-144 1 MM PITCH, FBGA-144
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE 16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 313 MHz 294 MHz
Combinatorial Delay of a CLB-Max 1 ns 1 ns
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 1452
Number of Equivalent Gates 24000 24000
Number of Inputs 111 111
Number of Logic Cells 1452 1452
Number of Outputs 111 111
Number of Terminals 144 144
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1452 CLBS, 24000 GATES 1452 CLBS, 24000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm 13 mm
Base Number Matches 1 2

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Compare A54SX16A-2FG144I with alternatives