A54SX16A-1FG256A
vs
A54SX16A-2FGG256A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
1 MM, FBGA-256
LBGA, BGA256,16X16,40
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
16000 TYPICAL GATES AVAILABLE
16000 TYPICAL GATES AVAILABLE
Combinatorial Delay of a CLB-Max
1.1 ns
1 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1452
1452
Number of Equivalent Gates
24000
24000
Number of Inputs
180
180
Number of Logic Cells
1452
1452
Number of Outputs
180
180
Number of Terminals
256
256
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1452 CLBS, 24000 GATES
1452 CLBS, 24000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.68 mm
1.68 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
3
3
Clock Frequency-Max
313 MHz
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
250
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare A54SX16A-1FG256A with alternatives
Compare A54SX16A-2FGG256A with alternatives