A54SX16-1PQG208PP
vs
A54SX16P-1PQ208M
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
FQFP,
|
QFP, QFP208,1.2SQ,20
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
280 MHz
|
241 MHz
|
Combinatorial Delay of a CLB-Max |
0.8 ns
|
|
JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
JESD-609 Code |
e3
|
|
Length |
28 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
1452
|
|
Number of Equivalent Gates |
16000
|
|
Number of Terminals |
208
|
208
|
Organization |
1452 CLBS, 16000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
28 mm
|
|
Base Number Matches |
3
|
2
|
ECCN Code |
|
3A001.A.2.C
|
Number of Inputs |
|
175
|
Number of Logic Cells |
|
1452
|
Number of Outputs |
|
175
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Equivalence Code |
|
QFP208,1.2SQ,20
|
Temperature Grade |
|
MILITARY
|
|
|
|
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