A54SX16-1CQ208
vs
A54SX16-1CQG208
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ACTEL CORP
|
MICROSEMI CORP
|
| Package Description |
CERAMIC, QFP-208
|
QFF,
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
24000 SYSTEM GATES AVAILABLE
|
24000 SYSTEM GATES AVAILABLE
|
| Clock Frequency-Max |
240 MHz
|
240 MHz
|
| Combinatorial Delay of a CLB-Max |
0.9 ns
|
0.9 ns
|
| JESD-30 Code |
S-CQFP-F208
|
S-CQFP-F208
|
| JESD-609 Code |
e0
|
e4
|
| Length |
29.21 mm
|
29.21 mm
|
| Number of CLBs |
1452
|
1452
|
| Number of Equivalent Gates |
16000
|
16000
|
| Number of Inputs |
172
|
|
| Number of Logic Cells |
1452
|
|
| Number of Outputs |
172
|
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1452 CLBS, 16000 GATES
|
1452 CLBS, 16000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QFF
|
| Package Equivalence Code |
TPAK208,2.9SQ,20
|
TPAK208,2.9SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.06 mm
|
3.06 mm
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
GOLD OVER NICKEL
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
29.21 mm
|
29.21 mm
|
| Base Number Matches |
2
|
3
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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