A54SX08A-TQG100A
vs
A54SX08A-TQG100I
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
ACTEL CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP,
|
1.40 MM, TQFP-100
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
ALSO REQUIRES AN SUPPLU OF 3.3V
|
8000 TYPICAL GATES AVAILABLE
|
| Combinatorial Delay of a CLB-Max |
1.5 ns
|
1.2 ns
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e3
|
e3
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
512
|
768
|
| Number of Equivalent Gates |
8000
|
12000
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512 CLBS, 8000 GATES
|
768 CLBS, 12000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
2.625 V
|
2.75 V
|
| Supply Voltage-Min |
2.375 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
2
|
| Number of Inputs |
|
127
|
| Number of Logic Cells |
|
768
|
| Number of Outputs |
|
127
|
| Package Equivalence Code |
|
QFP100,.63SQ,20
|
|
|
|
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